New Step by Step Map For Noohapou
New Step by Step Map For Noohapou
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The POU3500 technique delivers dynamic temperature control of the procedure chamber cathode / electrode / anode and can be synchronized with any etch procedure.
thirty% of its peak ability intake, providing our buyers substantial reduction in functioning prices and enhanced reliability.
Together with the POU3500, you can attain unparalleled results in etch overall performance, chamber uptime, minimized price of possession and fab Place utilization – all although strengthening your procedure dependability.
at first Launched in 1985, our enterprise has developed right into a regarded chief in offering temperature Command units to the global semiconductor sector.
This impressive method, offering a small form element, low priced-of-possession and Dynamic Temperature Manage made available method and products engineers a whole new Instrument to enhance their temperature sensitive procedures.
The accuracy from the POU 3300 allows for impartial Charge of the procedure fluid temperature into the wafer chuck within just +/- 0.one °C of established level, and also the fast reaction time of your program lets for optimum wafer-to-wafer repeatability through the etch approach.
All static TCUs have to have extra cooling & heating capacities because of their incredibly large method fluid reservoirs. the procedure fuid reservoir on LAUDA-Noah's dynamic temperature Manage program is under one gallon.
With all the POU3300, you could obtain unprecedented ends in etch overall performance, chamber uptime, decreased price of ownership and fab Room utilization – all while strengthening your system trustworthiness.
the info pertains to the 300mm chamber temperature profile throughout a superior part ratio Etch system, running at extremely high RF website electrical power problems (~three.8kW). The persuasive facets of this facts established are:
Dynamic Temperature Regulate, as executed in devices similar to the LAUDA-Noah POU, is surely an strategy that senses the temperature of the process fluid getting back from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature on the provided approach fluid according to this serious-time comments.
The TEs' can swap straight from heating to cooling, or visa-versa. They can turn on & off when from the heating or cooling mode and can raise or lessen the quantity of heating or cooling without the need of switching whatsoever.
The POU3300 program provides dynamic temperature Charge of the method chamber cathode / electrode / anode and might be synchronized with any etch system.
verified; TEs' symbolize just one Section of a chiller's design. The switching & control techniques employed by a chiller will impression the TEs' reliability.
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